Nanofabrication Facilities

Innovation at the nanoscale
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NDS possesses the deposition capabilities for semiconductor, dielectric, and conductive thin films (amorphous, nanocrystalline and poly-Si, SiOx, SiNx, SiOxNy, SiC, SiCN, ITO, ZnO, Al, Cr, Mo, W, Ta, organic materials (both small molecule and polymers). The maximum substrate size varies from 3 to 6 inches. Our deposition equipment supports ALD, PECVD, LPCVD, and PVD technologies that allows for controlled and uniform deposition of thin films.

Equipment we have access to
  • Oxford Instruments System 100 PECVD / FlexAL ALD (Thermal & Plasma) Cluster System
  • Tytan 4600 Mini LPCVD Low Temperature Oxidation (LTO) Furnace
  • Tytan 4600 Mini LPCVD Poly SIlicon and Silicon Carbide Furnace
  • Tytan 4600 Mini LPCVD Silicon Nitride Furnace
  • Tytan 4600 Mini Thermal Oxidation Furnace
  • Allwin21 AccuThermo AW 610 Rapid Thermal Processor (RTP)
  • Intlvac Nanochrome II PVD E-Beam & Resistive Heating Thermal Evaporator
  • Plassys Bestek MP700S PVD Nb Superconducting Films Sputter System
  • AJA ATC Orion Series PVD Twin Chamber Sputter System
  • Angstrom Evovac Vacuum Deposition System
  • AJA ATC Orion Series Sputtering Tool
  • Edwards Sputtering System
  • Intlvac Thermal/E-beam Evaporator
  • PlasmaTherm 790 series PECVD
  • MVSystems Reel to Reel Cluster Tool
  • Selenium Evaporator (no brand shown)
  • WLOS Cluster Sputtering System
  • WLO1 and WLO2 Deposition Systems
  • CeraPrinter L-Series Ceradrop Printer


Etching selectively removes materials from the surface of the nanodevice to create topographical features by utilizing liquid chemicals or gaseous physico-chemical processes, also commonly known as wet etching and dry etching respectively. We offer both wet and dry etching (F-based, O-based, and Cl-based dry etching (RF,ICP)) services supporting RIE, ion milling, O2 plasma and wet processing technologies.

Equipment we have access to
  • AJA ATC-2030 Ion Mill
  • YES-CV200RFS Photoresist Strip
  • Oxford Instruments ICP380 Deep Silicon Etch (DRIE)
  • Oxford Instruments ICP380 Metal & III-V Materials RIE
  • FineLine Fabrications, Inc. Wet Processing Station
  • Phantom II Reactive-Ion Etching System

Lithography and Patterning

UV and electron-beam technologies are utilized to fabricate patterns into substrate material. UV lithography generates a desired pattern on the substrate’s surface through exposure to UV light, while electron-beam lithography utilizes an electron beam to scan a material and form the desired pattern.

Equipment we have access to
  • RAITH150 Two E-Beam Lithography System (30kV)
  • JBX-6300FS Electron Beam Lithography System (100kV)
  • SUSS MicroTec MA6 Front/Back Mask Aligner
  • SUSS MJB3 Mask Aligner
  • SUSS MA6 Mask Aligner
  • Thermo Scientific 3490M Class 100 Cleanroom Convection Oven
  • YES-310-TA Vacuum Oven: HMDS & Image Reversal
  • Reynoldstech (hood) & Headway Research (spin coaters): Custom hood equipped with PMW32-PS spinners
  • Brewer ScienceSpin Coater: E-Beam and UV Resists: Custom exhausted enclosure equipped with CEE 200X spinner and 1300X vacuum hotplate
  • Focused Ion Beam System


NDS boasts a wide variety of characterization equipment including surface profiling, sheet resistance and thin film stress measurement, ellipsometry, as well as SEM and AFM microscopy to measure surface characteristics for materials such as semiconductor wafers, lithography masks, magnetic media, CDs/DVDs, biomaterials, optics, and other samples up to 200 mm in diameter.

Equipment we have access to
  • 4-Point Probe
  • Electrical Probe Station
  • Woollam M-2000DI Ellipsometer
  • Helium Ion Microscope
  • Olympus MX-61 Semiconductor Microscope
  • Reflectometer: Thin Film Mapping
  • Reflectometer: Thin Film Spot Measurement
  • Surface Profiler
  • TOHO FLX-2320-R Wafer Stress Measurement
  • Dektak 8 Stylus Profilometer
  • Dimension 3100 Scanning Probe Microscope
  • Hitachi S-3000N Scanning Electron Microscope
  • Zeiss FESEM 1530 Scanning Electron Microscope
  • Zeiss Libra 200MC Transmission Electron Microscope
  • Keithley 4200-SCS Semiconductor Characterization System
  • FT-IR 8400S Spectrometer
  • UV-2501PC Spectrometer
  • Renishaw Micro-Raman Spectrometer
  • Reichert Polylite 88 Microscope
  • Ionic Systems Stressgauge